BGA (Ball Grid Array) solder ball array packaging is suitable for head shapes of four claws and slightly smaller diameter four claws. It mainly depends on the size of the ball. If the tin ball contains lead, use the method of supporting the ball, and if not, use the method of stabbing the ball, as shown in the following figure.
QFN (Quad Flat No Lead) square flat pin less package is the most suitable for measuring and reducing the F-head type. It can also be used for pointed heads with angles below 60 °, with chamfers of 0.02-0.05mm, to pierce through the thin oxide layer on the surface of solder joints. If you want to consider the possibility of leaving probe marks on the surface, you can use pointed heads with angles greater than 60 °, as they use lead-free processes, so round heads are not considered.
QFP (Quad Flat Package) square flat packaging technology, which can be used for packaging with small four claws or pointed heads greater than 60 degrees; When the pitch of the package is relatively small and there is a lot of lead, using small four claws is more appropriate, which can increase the chance of contact between the probe and the measured object. When the pitch of the package is relatively large and there is less lead, a tip greater than 60 ° can be selected for testing.
